Themes: Open Ended, Social Good. Cash prizes available. Submission window: Jul 18 - Oct 08, 2026.
Hardware Engineering internship for Summer 2026, Winter 2026, Spring 2026, Fall 2026.
Software Engineering internship for Summer 2026.
Themes: Machine Learning/AI, Open Ended, Productivity. Cash prizes available. Submission window: Jul 20 - Aug 05, 2026.
Themes: Education, Health, Machine Learning/AI. Cash prizes available. Submission window: Jul 23 - Aug 15, 2026.