Themes: Cybersecurity, Machine Learning/AI, Open Ended. Cash prizes available. Submission window: Jul 10 - 11, 2026. Eligibility: Nepali Students.
Hardware Engineering internship for Summer 2026, Winter 2026, Spring 2026, Fall 2026.
Software Engineering internship for Summer 2026.
Themes: Machine Learning/AI, Open Ended, Productivity. Cash prizes available. Submission window: Jul 20 - Aug 05, 2026.
Themes: Education, Health, Machine Learning/AI. Cash prizes available. Submission window: Jul 23 - Aug 15, 2026.